The National Integrated Circuit Industry Investment Fund (China IC Fund) plans to reduce its stake in Techbond, a national‑level “little giant” specialized in advanced electronic packaging materials.

According to Techbond’s April 17 announcement, the fund will sell up to 4.2672 million shares (3% of total equity) via block or centralized bidding between May 14 and August 13, 2026. After the sale, the fund will hold 15.1491 million shares (10.65%) . The shares come from pre‑IPO unlocked stock. Reason: own capital arrangements.

Techbond focuses on die attach adhesives, thermal interface materials, underfill – serving domestic chip design and packaging houses. This business accounts for 16%–17% of revenue and is growing steadily.

This is the third reduction in 12 months – following a block trade in May 2025 and another in September‑October 2025. The moves reflect the fund’s routine exit strategy as an industry investment vehicle, recycling capital for newer frontiers – not a bearish view on the sector.

ICgoodFind: The fund’s exit is a normal stage‑gate move – Techbond remains solid with room for domestic substitution. Watch the pace.