Infineon has launched its 600V CoolGaN™ Drive HB G5 series, packing a complete half-bridge power stage with two 600V CoolGaN™ G5 transistors, a level-shift gate driver, and a bootstrap diode into a tiny 6x8mm TFLGA-27 package.
The result? Compared to discrete solutions, this integration slashes component count by 75% and cuts PCB area in half, while also reducing weight, cost, and system complexity.
Part Numbers:
IGI60L1414B1M
IGI60L2727B1M
IGI60L5050B1M
Key Features:
Integrated level-shift gate driver & bootstrap diode
PWM input compatible
Wide VDD range (10–24V)
dv/dt rate control
Zero reverse recovery charge
Performance Meets Thermal Management:
High-speed switching with propagation delay as low as 98ns, minimal mismatch between channels
Excellent thermal performance via exposed pad in package
Single 12V supply for gate driver with fast UVLO recovery
JEDEC-qualified for industrial apps
Target Applications:
USB-C adapters & chargers
HEV DC-DC converters & SRM drives
Low-power motor drives
Low-power SMPS
ICgoodFind : Infineon crams the GaN power stage and driver into one chip. Cut your board space in half and slash components by 75%. That's real power design evolution.
